Non-Contact Measurement of Smallest Components

Monitoring of electronic components and assemblies has been an essential field of application in thermal imaging for a long time. A particular advantage is the possibility of temperature measurements without any contact, since other measurement processes can lead to distortions caused by contacting sensors, especially in case of smaller components. Apart from that, smaller structures can hardly be sensed by contact sensors, and only high spatial resolution of infrared camera systems can make single components visible.

Since assemblies often operate with low electrical power, temperature changes are also very small. Besides an excellent thermal resolution methods of active heat flow thermography are, if the circumstances require, necessary for measurements. Thus, damages to electronic assemblies can be detected by means of lock-in thermography, even if the assembly itself does not release heat and no hot spots are visible.

Case Study

Micro thermographic image of low resistance precision resistors

Usage of VarioCAM® for Electronics and Electrical Industry

Heat is one of the most important parameters for weal and woe during production processes and for product quality. Therefore, measuring heat has always had major relevance which is reflected by the early use of temperature sensors during the automation of production processes. Now the fast visualization of temperature distributions with non-contacting thermal imaging allows even more complex automated solutions without using contacted temperature sensors.

Excellent Interaction Between the Infrared Camera, its Software and Periphery

thermal imaging of a circuit board

An optimal interplay between infrared camera and software is inevitable. The thermographic software IRBIS® 3, for instance, integrates procedures of active heat flow thermography. Moreover, it provides a comparison between the current thermal image and a reference image. Thus, deviations from the norm can be displayed in a perfectly clear way.

In the course of board (PCB) testing, multiple components result from a vast number of different emissivities which might lead to deviations from measurement results. For this purpose, the software IRBIS® 3 provides an integrated solution which enables users to determine the emissivity of each single pixel.

Operational concept thermographic software IRBIS 3

The software IRBIS® 3 supports InfraTec's infrared camera systems and can perfectly be applied in the field of electronics manufacturing. Apart from highest spatial resolutions, reaching up to megapixel range, InfraTec provides a broad range of interchangeable lenses. Therefore, smallest details of electronic components can be measured accurately from a short distance with the help of infrared camera systems equipped with close-up and microscopic lenses.

Get in contact with InfraTec thermography division

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It is not unusual for tasks to be associated with special requirements. Discuss your specific application needs with our specialists, receive further technical information or learn more about our additional services.


InfraTec GmbH
Infrarotsensorik und Messtechnik
Gostritzer Str. 61 – 63
01217 DresdenGERMANY

Infrared Cameras for Electronics and Electrical Industry